No limitations on BGA, LGA, QFN, DFN, QFP, TSOP or SSOP

No limitations on chip components down to 0201's

No limitations on thru-hole technology

No Limitations on PWB Materials or Complexity

Quality per IPC-A-610 class 2 and 3

Process Control per J-STD-001

Rework per IPC-7711

Repair per IPC-7721

No limitations on component removal and replacement

No limitations on BGA removal, re-balling and replacement

Proprietary Compression Reflow process for complex microwave assembly